北京 [切换城市] 北京招聘

后段封装专家 (BEOL Packaging)副本 (职位编号:006072)

中芯国际集成电路制造(上海)有限公司

  • 公司规模:10000人以上
  • 公司性质:外资(非欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2019-06-17
  • 工作地点:上海-浦东新区
  • 招聘人数:1人
  • 工作经验:8-9年经验
  • 学历要求:硕士
  • 职位月薪:2.5-3万/月
  • 职位类别:其他

职位描述

岗位职责:

Full ownership of CPI related topics for all SMIC FinFET products, including
- CPI test and qualification vehicle specification and design overview. Definition of CPI test structures, both on Silicon and in the package.
- Support to BEOL Integration & Reliability Engineering teams to build full and partial flow wafers through fab and post-fab operations.
- Interfacing with internal and external (OSAT) engineering teams to enable overall development and qualification efforts (i.e. process window experiments utilizing DoEs, wafer probe/test, reliability testing).
- Definition and maintenance of CPI related design rules in all relevant Design Manuals.
- Review and approval of all fab & OSAT process changes relevant to CPI.
- Close collaboration and alignment with SMIC extended CPI teams across all BUs.
- Support of the Customer Engineering and Field Engineering Teams with any CPI related activities.
- Effectively communicate project results and updates to key stakeholders, both internal and external to SMIC.


任职资格:

- ≥5 yrs package (Bumping & Assembly) process integration (NPI or RND or TPM or PE) experience with very good leadership for new production phase in and qualification
- Experience of advance fab tech. and package type (Flip chip, Fan-out, SIP, PoP etc.)
- Deep study of CPI (chip package interaction) related process modules (bumping, back grinding, laser groove, flip chip attached, reflow profile, under-fill, molding etc.)
- Deep study of package design total solutions (package structure design, process design, package material selection, mechanical/electrical/thermos-analysis simulation etc. ) for CPI risk mitigation.
- Good project management skill (milestone definition, coordination of cross function team, troubleshooting, execution following up, report summary/presentation skill etc.)

职能类别: 其他

公司介绍

中芯国际集成电路制造有限公司(“中芯国际”,纽交所代号:SMI,港交所股份代号:981),是世界领先的集成电路晶圆代工企业之一,也是中国内地技术***面、配套最完善、规模***、跨国经营的集成电路制造企业,提供0.35微米到28纳米不同技术节点的晶圆代工与技术服务。中芯国际总部位于上海,拥有全球化的制造和服务基地。 在上海建有一座300***晶圆厂和一座200***晶圆厂;在北京建有一座300***晶圆厂和一座控股的300***先进制程晶圆厂;在天津和深圳各建有一座200***晶圆厂;在江阴有一座控股的300***凸块加工合资厂;在意大利有一座控股的200***晶圆厂。中芯国际还在美国、欧洲、日本和中国台湾地区设立行销办事处、提供客户服务,同时在香港设立了代表处。详细资讯请参考中芯国际网站*************。

联系方式

  • 公司地址:上海市浦东新区张江路18号 (邮编:201203)