资深数字IC后端设计
北京德才仕科技有限公司
- 公司规模:少于50人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-03-29
- 工作地点:上海-浦东新区
- 招聘人数:2人
- 工作经验:无工作经验
- 学历要求:本科
- 职位月薪:1.8-3.6万/月
- 职位类别:集成电路IC设计/应用工程师
职位描述
资深数字后端设计
地点:上海/北京
Description:
- Perform physical design implementation, including floorplan, power grid design, P&R, CTS, timing closure, power/signal integrity signoff, DRC/LVS/Antenna, EM/IR signoff, DFM Closure.
- Participate in or lead next generation PHY IP or SOC physical design, methodology and flow development.
Requirements:
- BS degree with 6+ years of experience, MS degree with 3+ years of experience in electrical engineering, microelectronics.
- Experienced with ASIC design flow, hierarchical physical design strategies, and methodologies and understand deep sub-micron technology issues.
- Solid knowledge on low power design, static timing analysis, EM/IR-Drop/crosstalk analysis, physical verification, DFM. Successful track records of taping out complex, 16nm/10nm/7nm chips.
- Automation and programming-minded, solid coding experience in Makefile/Tcl/Tk/Perl.
- Self-motivated, able to work independently or as a team player, excellent verbal and written communication skills in English.
职能类别: 集成电路IC设计/应用工程师
公司介绍
联系方式
- 公司地址:北京市朝阳区 (邮编:100025)