北京招聘

Description

Job Description

The Global Engineering Services' Competitive Analysis & Benchmarking organization gives HP a unique perspective on how their products compete in the marketplace. We're looking to expand our team of engineers that will be responsible for doing deep dive teardowns, should-cost analysis, comparisons and analyses of HP and competitive products.

Teardowns:

- Participate in product level teardowns of HP and competitive products. This includes being a core team member that will physically dismantle products, catalog components and create a bill of materials.

- Be familiar with the mechanical architecture of electronic products. This core team member will help provide an overview of the features and mechanical architectural differences between the systems.

Should cost analysis:

- Demonstrate proficiency & knowledge of a wide variety of hardware design disciplines used in the mechanical architecture of electronic products, including thermal engineering and structural analysis. The ideal candidate should be familiar with the various safety & regulatory requirements applicable to electronic products (EMC, safety, regulations, and legislative directives). The individual should be able to apply their expertise on the functionality and cost of the mechanical design.

Comparison and analysis:

- Compare and analyze the value of competing designs. The individual will understand the cost/function of the competing designs. The analysis will highlight areas where the competition is providing the same function at a lower cost or providing additional features at the same cost.

- Additional analysis will focus on highlighting cost reduction and efficiency recommendations, where appropriate.

Other:

- Work with a variety of HP teams, suppliers and industry partners across the globe. This individual will collaborate and communicate with management, internal, and outsourced manufacturing and development partners regarding process and process costs and technologies. They will collaborate with project team of other engineers to provide whole picture cost analysis and comparison. Some travel will be required for this position.

Qualifications

Profile

Education

Bachelors or M.S. degree in Mechanical or Hardware Engineering (or related field) is a requirement. Experience in electronic product design and analysis is a plus.

Experience and Knowledge

-Significant experience in electronic product design and analysis.

-Knowledge of a wide variety of hardware design disciplines used in the mechanical architecture of electronic products, including thermal engineering and structural analysis.

-Experience in Pro/E, CoCreate and other modeling, simulation and analysis tools (FEA).

-Knowledge of the various safety & regulatory requirements applicable to electronic products (EMC, safety, regulations, and legislative directives).

-Demonstrated ability to perform analysis and comparison of the value of competing designs.

Skills

-Excellent written and oral communication skills.

-Fluency in English & local language.

-Outstanding presentation skills.

-Excellent interpersonal, teamwork and collaboration skills.

-Demonstrated ability to lead large, cross- functional teams.

-Demonstrated program management ability within complex technical disciplines.

-Demonstrated excellent organizational and time management skills.

-Logical problem-solving skills.

惠普（HP）公司成立于1939年，是一家业务运营遍及全球170多个国家和地区的高科技公司。我们致力于探索科技和服务如何帮助人们和企业解决其遇到的问题和挑战，并把握机遇、实现愿景、成就梦想。我们运用新的思想和理念来打造更简单、更有价值、更值得信赖的技术体验，不断帮助客户改善其生活和工作方式。

惠普（HP）是全球最大的信息科技（IT）公司之一。我们提供广泛的基础设施和商业产品，从手持设备到世界上最强大的超级计算机，一应俱全。我们为消费者提供了一系列广泛的产品和服务，从数码摄影到数码娱乐，从计算产品到家用打印。这一全面的产品组合让我们能够针对客户的特定需求，提供合适的产品、服务和解决方案。在截止至2007年10月31日的2007财年中，惠普（HP）的营业额达1043亿美元，在2007年美国财富500强中排名第14位。

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