北京 [切换城市] 北京招聘北京电子/电器/半导体/仪器仪表招聘北京集成电路IC设计/应用工程师招聘

GPU Silicon Bring up lead

超威半导体(中国)有限公司

  • 公司规模:1000-5000人
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2019-11-28
  • 工作地点:上海-浦东新区
  • 招聘人数:若干人
  • 工作经验:无工作经验
  • 学历要求:招若干人
  • 语言要求:不限
  • 职位类别:嵌入式硬件开发(主板机…)  集成电路IC设计/应用工程师

职位描述

GPU Silicon Bringup Lead

Job Location: Shanghai

Department: Graphics Platform Engineering (GPE)


Description:

AMD Graphic Platform Engineering (GPE) team is seeking an experienced engineer to lead the dGPU bringup. As part of the GPE Systems Engineering team, the Silicon Bring-up Lead will be responsible for leading the bring-up and debug support of the latest graphics IP’s for AMD’s Fusion APU’s and DGPU’s. The successful candidate will be providing hardware-engineering support during pre-silicon planning, post-silicon bring-up, validation and production ramp.

You will be involved in the pre-silicon and post-silicon phases of the design. In the pre-silicon phase, you will be leading planning activities and developing creative solutions and processes to meet aggressive post-silicon schedules while working intimately with silicon design engineers and platform design engineers. In the post-silicon phase, as prototypes are received, using your pre-silicon knowledge, you will lead systems engineering and silicon design teams through the various phases of bring-up, validation and production ramp while working in the laboratory debugging hardware issues. You will also occasionally assist the customer support services team address customer design issues, as needed. In essence, you will be the link between design and physical silicon. The right candidate will be required to work closely with silicon design engineers as well as participate in and/or lead interdisciplinary teams (hardware, software, program management, customer engineering, operations, marketing and sales).


Responsibilities:

- dGPU bringup lead is key technical lead in the program core team to lead all the engineering teams(ASIC design, board design, VBIOS, driver, diag, product engineering teams, etc) in the company to make the new tape out dGPU chips success

- Drive global function teams (ASIC design, platform, driver, etc.) collaboration to enable all features and optimize performance and meet the program schedule

- Drive global function teams (ASIC design, platform, driver, etc.) to resolve all issues happen in bringup and validation

- Work with product engineering and characterization team to work out the clocks/voltages for dGPU and maximum yield and performance at given TDP


Requirements:

- B.S. or M.S. In EE or CS or equivalent is required

- Fluent verbal English required

- A minimum of 5+ years’ experience on ASIC NPI program

- Hands-on experience with any one of ASIC bring up, validation, characterization, product definition or program management

- Strong team work experience with difference functional teams

- Strong communication skills

- Strong leadership for technical or program driving

- Familiar with any of HW design, driver develop or ASIC design


公司介绍

AMD公司成立于1969年,总部位于美国加利福尼亚州桑尼维尔。AMD(NYSE: AMD)是一家创新的科技公司,致力于与客户及合作伙伴紧密合作,开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。AMD的业务遍布全球,拥有约为12000名员工。

联系方式

  • Email:bella.yu@amd.com
  • 公司地址:上海-浦东新区 张江 环科路669号凯瑞大厦