北京招聘

Description

As Quality Program Manager in the TCE&Q team you will be responsible for all aspects of ODM platform sustaining activities: Monitoring product quality performance, responding to customer escalations, and determining service strategy for the installed base. You will work with cross-functional team members and ODMs to ensure compliance with agreed upon SLA for closure of product issues related to quality and functionality, and reliability. Your technical expertise and leadership will ensure quick resolution to complex technical issues. You will employ a variety of data sources to understand product quality trends and will communicate your findings to ODM and internal HP teams for corrective action. Using the 8D process, you will work with ODMs, suppliers, and R&D to ensure manufacturing, quality, and design issues are driven to closure, resulting in a high quality product that pushes the limits of performance and user experience.

Additional specific responsibilities include:

· Communicate and manage quality goals and expectations for the platform

· Support 3LS escalations from a technical standpoint through corrective action

· Support/generation of Support communications (Engineering, Service, Customer advisories)

· Help define functional equivalency requirements

· Evaluation of the ODM through use of High Performance Supplier Scorecard

· Monitor repair data and test processes at service centers for whole unit repair to drive improvements in service and product quality

· Evaluate ODM systemboard RMA data to ensure the top issues are being corrected

Qualifications

Bachelor's degree in Electrical or Mechanical Engineering required, Masters preferred.

· Minimum of 8-10 years experience in product engineering environment

· Demonstrated expertise in design, development and integration of digital hardware, firmware and software systems, or mechanical product design including physical, thermal, acoustics, safety, regulatory and reliability.

· Demonstrated success leading technical development or system qualification in an ODM partnership model.

· Proven ability to work with strategic technology suppliers on leading edge designs.

· Well-developed teamwork and communication skills.

· Detailed in data analysis activities

· Advanced knowledge in the field of PC hardware, diagnostics. repair workflow

· Knowledge of customer support and process definition.

· Strong analytical problem solving skills

· Good team work and communication skills

If you are interested in the position, you can mail cv to caihua.yu@hp.com

惠普（HP）公司成立于1939年，是一家业务运营遍及全球170多个国家和地区的高科技公司。我们致力于探索科技和服务如何帮助人们和企业解决其遇到的问题和挑战，并把握机遇、实现愿景、成就梦想。我们运用新的思想和理念来打造更简单、更有价值、更值得信赖的技术体验，不断帮助客户改善其生活和工作方式。

惠普（HP）是全球最大的信息科技（IT）公司之一。我们提供广泛的基础设施和商业产品，从手持设备到世界上最强大的超级计算机，一应俱全。我们为消费者提供了一系列广泛的产品和服务，从数码摄影到数码娱乐，从计算产品到家用打印。这一全面的产品组合让我们能够针对客户的特定需求，提供合适的产品、服务和解决方案。在截止至2007年10月31日的2007财年中，惠普（HP）的营业额达1043亿美元，在2007年美国财富500强中排名第14位。

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