硬件工程师 Hardware Engineer (职位编号:03558)
戴泺格半导体(深圳)有限公司
- 公司规模:1000-5000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-05-14
- 工作地点:北京-海淀区
- 招聘人数:1人
- 工作经验:无工作经验
- 学历要求:招1人
- 语言要求:不限
- 职位月薪:1.5-2.5万/月
- 职位类别:其他 集成电路IC设计/应用工程师
职位描述
Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today’s leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog’s decades of experience and world-class innovation help manufacturers get to what’s next.
Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2017, it had US$1.4 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,070 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax index.
As part of our continued growth, we seek a Senior Hardware Engineer (Home Appliance) to work closely with Design team, taking responsibility of existing product support and new projects development and evaluation.
The role
Working in CTC team based in Beijing, you will:
· Work on existing products testing, EVB design and Customer supporting.
· Complete applications reporting and products testing reporting document
· Work with Marketing/Design team for new production defining and development.
· Work with Design team on evaluation and debugging of new products.
· Ensure new products have been fully tested at FPGA environment phase before tape-out and application phase before delivering to customer.
· Give training to FAE and Marketing team to ensure they understand well and correctly use the products.
What we are looking for?
· Master Degree or above in Electronic Engineering or Electrical Engineering.
· 5+ years’ experience in application system level hardware design and debugging.
· Solid experience in IC & System architecture, simulation and calculation.
· Experience in Power IC and system level design will be a plus.
· Proficiency in test/analysing equipment just like signal generator, scope and so on. Familiar with EDA design tool, such as PADS, Orcad Allegro or Protel.
· Good team-player with open-minded and proactive working style, and flexibility to work in night or weekend for urgent cases.
· Good communication skill in English.
**IMPORTANT NOTE: The salary above is for REFERENCE ONLY; all salary numbers in
our postings are subject to your
seniority, experience, and technical expertise
etc., and it’s NEGOTIABLE.**
Why join us?
We passionately believe that working at Dialog, you will be joining the brightest, most diverse and ambitious talent in the Semiconductor Industry. We are proud to have won numerous awards and designs, including exclusive patents that have assisted us to years of double-digit growth in this highly competitive industry. With growth planned for 2018, the opportunity for talent to progress at Dialog could not be greater. We are fast becoming the employer of choice within microelectronics chip design, power management solutions, short-range wireless connectivity and AC/DC power conversion.
If you'd like to explore working for Dialog Semiconductor further, then it's time we heard from you. Click below and apply now.
职能类别: 其他 集成电路IC设计/应用工程师
公司介绍
Dialog执行稳健,增长快速,并具有强大的现金产生能力;截至2018年12月31日,现金及现金等价物余额为6.78亿美元。全球员工总数达2,100人(工程师约占75%)。
Dialog作为雇主积极承担社会责任,开展各项活动造福员工、社区、其他利益相关方和自然环境。
关键要点
智能手机PMIC市场份额排名***
智能手机RapidCharge?快充电源适配器IC市场份额排名***
可配置混合信号IC(CMIC)市场份额排名***
集成度***,采用可配置电源管理模式的完整系统方法
2017年,我们交付了超过1亿套SmartBond? SoC,创下了里程碑
蓝牙低功耗市场份额排名***,交付了超过1.8亿套具有业内最低功耗的蓝牙芯片。
2018年营收达14.42亿美元
联系方式
- 公司地址:天津经济技术开发区信环西路19号泰达服务外包产业园