Mechanical &Thermal Engineer
恩智浦(中国)管理有限公司
- 公司规模:10000人以上
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2017-07-15
- 工作地点:上海-闸北区
- 招聘人数:若干人
- 学历要求:本科
- 职位月薪:20-30万/年
- 职位类别:其他
职位描述
职位描述:
NXP Semiconductor is the global leader in embedded processing solutions, supporting the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog ICs and connectivity — our vital technologies are the foundation to the innovations that make our world greener, safer, healthier and more connected. For more than 50 years, NXP has played an essential role in the evolution of embedded solutions, and we want you to be a part of our next half-century. NXP is committed to attracting great people of all styles, thoughts, cultures and backgrounds.
Board Solutions Team acts as a one-stop provider for hardware development solutions for embedded microprocessors have been widely adopted by customers worldwide. Shanghai Board Solutions team supports the New Production Introduction (NPI), system design, hardware manufacturing & system integration. NXP Boards Solutions Team now offer the technical position of Mechanical & Thermal Engineer for mechanical design and thermal analysis.
The Mechanical & Thermal Engineer has responsibility to:
? Draw 2D/3D mechanical design for metal/plastic enclosures.
? Cooperate with PCB layout designer (CAD) to define and review mechanical solution.
? Mechanical manufacturing management between customer & supplier.
? Release mechanical drawing and relevant assembly instruction.
? Initiate cost reduction activities from design point view.
? Design Manufacturing fixture/jig.
? PCB board or system thermal design, simulation analysis and test validation
Required Skills & Qualifications:
? Bachelor or Master degree in mechanical or electronics product design, or related field.
? 5-10 years of mechanical design or equivalent working experience in a design or manufacturing environment.
? Familiar with metal/plastic enclosures manufacturing process.
? Master software tools like Proe/Solidwork.
? PCB board thermal analysis knowledge and experience.
? System level thermal simulation is a plus.
? Capability of thermal measurement (equipment and methodology).
? Personal interest to study more new knowledge and technology.
? Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.
? Have a determined mindset and personal commitment to high quality work with schedule.
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NXP Semiconductor is the global leader in embedded processing solutions, supporting the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog ICs and connectivity — our vital technologies are the foundation to the innovations that make our world greener, safer, healthier and more connected. For more than 50 years, NXP has played an essential role in the evolution of embedded solutions, and we want you to be a part of our next half-century. NXP is committed to attracting great people of all styles, thoughts, cultures and backgrounds.
Board Solutions Team acts as a one-stop provider for hardware development solutions for embedded microprocessors have been widely adopted by customers worldwide. Shanghai Board Solutions team supports the New Production Introduction (NPI), system design, hardware manufacturing & system integration. NXP Boards Solutions Team now offer the technical position of Mechanical & Thermal Engineer for mechanical design and thermal analysis.
The Mechanical & Thermal Engineer has responsibility to:
? Draw 2D/3D mechanical design for metal/plastic enclosures.
? Cooperate with PCB layout designer (CAD) to define and review mechanical solution.
? Mechanical manufacturing management between customer & supplier.
? Release mechanical drawing and relevant assembly instruction.
? Initiate cost reduction activities from design point view.
? Design Manufacturing fixture/jig.
? PCB board or system thermal design, simulation analysis and test validation
Required Skills & Qualifications:
? Bachelor or Master degree in mechanical or electronics product design, or related field.
? 5-10 years of mechanical design or equivalent working experience in a design or manufacturing environment.
? Familiar with metal/plastic enclosures manufacturing process.
? Master software tools like Proe/Solidwork.
? PCB board thermal analysis knowledge and experience.
? System level thermal simulation is a plus.
? Capability of thermal measurement (equipment and methodology).
? Personal interest to study more new knowledge and technology.
? Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.
? Have a determined mindset and personal commitment to high quality work with schedule.
职能类别: 其他
公司介绍
NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.
联系方式
- Email:fiona.chen@nxp.com
- 公司地址:西青开发区兴华路15号