北京招聘

职位描述：
Job Description
Job Description
The Equipment Development Engineer role in GSM is a critical to delivering direct impacts to Intel's wafer cost. You will join a team architecting a new equipment supply chain that Intel will rely on to deliver the maximum return on Intel's capital i***estments. In this role, you will be responsible for a fab toolset where you will work with the factory to define the technical feasibility and affordability of equipment reuse options and provide direction to maximize Intel's capital equipment throughout the lifecycle of the tool, including new and creative options not yet utilized. Additionally, you will own reference BOM completion for co***ersion kits and upgrade kits and provide technical expertise during tool specific BOM creation. You will also drive equipment supplier preparation, commitment and execution to the cradle to grave equipment plan from hardware, through resources and install while meeting safety, quality, cost and schedule requirements. You will work across the factory e***ironment, with Fab Process Engineers, Area Managers GSM engineers, GSM Commodity Managers, Fab Supply Chain reps, CPLG and CS as well as with equipment suppliers to resolve issues and develop creative solutions to problems as they arise. You will gain exposure to the entire Capital equipment process from feasibility through procurement and have the opportunity to directly impact Intel's wafer cost. Integral to success in this role, you will develop root cause solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools, and develop strategies and systems to deal with these problems in the future.
Job Description Summary
Candidate should have a minimum of 3 years of experience supporting a Semiconductor factory and equipment start-ups and ramps. Extreme attention to detail, high tolerance of ambiguity & adaptability with knowledge of change management, demonstrated root cause problem solving/analytical and time management skills, project/program management skills and the ability to work well in a highly matrixed e***ironment are critical. Other necessary skills include demonstrated stakeholder management and customer orientation, results orientation and demonstrated communication skills.Preference will be given to those candidates with knowledge and experience in design and equipment development, facilitation & tool I/Q processes as well as supply chain experience. 举报 分享

英特尔全球的***个存储技术研发生产基地，坐落在美丽的海滨城市大连。英特尔大连非易失性存储技术制造基地（Intel Dalian Memory Technology & Manufacturing以下简称DMTM）的拳头产品是英特尔3D NAND芯片。这项低成本高效能的3D NAND产品将撼动现有的市场格局，为我们描绘了一个更加光明的未来。简言之，这里销售的每一块内存芯片，都将对物联网，数据中心，虚拟现实和CPU相关领域的发展产生深远的影响——这些正是英特尔的核心增长领域。因此，大连存储技术研发生产基地对于英特尔的成功以及我们支撑智能互联的世界至关重要。
半导体集成电路是目前中国发展最为迅速的行业之一，并且也是中国“第十二五”“第十三五”等国家战略计划所重点扶持的产业。虽然中国半导体产业起步晚但发展迅速，连续多年保持两位数以上增速，显著高于全球增速。半导体集成电路行业发展前景十分广阔，Intel大连也希望能够接纳并培养出更多更优秀的本土人才。
Why - 集成电路-芯片高端制造
1.芯片制造是高速发展的集成电路产业中极其重要的环节之一；
2.就业前景广阔，待遇优厚；
3.行业技术附加值高，不易被时间淘汰，且从业越久市场价值越高，是一个值得长期发展的前景广阔的行业；
4.国内从业人数逐年增加，产业生态链逐步形成，市场将会有越来越多的晋升机会。
Why – 英特尔半导体是您开启半导体职业生涯的***选择
1.英特尔大连是Intel 全球***的NAND存储芯片集技术研发和规模化量产为一体的基地；
2.接触领先的芯片生产技术；
3.完善的培训体制和以人为本的优秀企业文化；
4.行业内极佳的口碑 & 多年***雇主获得者；
5.极具竞争优势的薪资待遇；
6.工作地点大连 - 气候宜人，房价适中的滨海宜居城市。
申请流程：网申→简历筛选→邀请面试
3.17- 大连理工宣讲
3.18- 大连海事大学宣讲
3.21- 大连现场面试: 海创(大连)科技交流中心酒店
3.22- 东北大学宣讲
3.23- 沈阳：东大校园面试
3.24- 沈阳：香格里拉酒店面试
3.25- 吉林大学宣讲
3.26- 长春：吉大校园面试
3.27- 长春：香格里拉酒店面试