北京 [切换城市] 北京招聘北京电子/电器/半导体/仪器仪表招聘北京集成电路IC设计/应用工程师招聘

Internship - Application Engineering (职位编号:Dialog02578)

戴泺格半导体(深圳)有限公司

  • 公司规模:1000-5000人
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2017-02-18
  • 工作地点:深圳
  • 招聘人数:2人
  • 职位月薪:3-4.5千/月
  • 职位类别:集成电路IC设计/应用工程师  电子软件开发(ARM/MCU...)

职位描述

职位描述:
As a continued practice to invite new talents for our internship program, we are hiring 2 interns to join our Application Engineering team in Shenzhen to Provide technical support to FAE and strategic customers to design-in the PCBG products. All while working closely with the US System Engineering team, participate in the product development, evaluation, sustaining and quality support, in various phases.

Main area of duties include:

? Document and log all work related to chip evaluations and feedback to the System and IC Design teams for device modifications and enhancements
? Create application note, design worksheet, tools and technical collaterals
? Design and support standard evaluation boards (EVBs), customized circuitry and demo boards
? Resolve critical customer issues under supervision by local mentor
? Sustaining and quality support in FAR process
? New product system level evaluations

In order to be a successful candidate:

? Graduate who wants to develop his/her knowledge and experience in ACDC Power area.
? Relevant studying subjects in Power Electronics and/or Electronics Engineering
? Excellent communication skills with ability to articulate complex technical subjects in a confident and clear way
? Ability to learn and apply skills quickly, and willing to take the initiative
? Fluent in English

职能类别: 集成电路IC设计/应用工程师 电子软件开发(ARM/MCU...)

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公司介绍

Dialog是为智能手机、可穿戴设备、IoT和汽车应用优化提的高度集成混合信号IC的技术领先供应商。公司采用无晶圆厂制造模式,生产、组装和封装均外包;拥有业界规模***的定制混合信号IC设计团队,并与***OEM厂商建立了牢固的战略合作关系。

Dialog执行稳健,增长快速,并具有强大的现金产生能力;截至2018年12月31日,现金及现金等价物余额为6.78亿美元。全球员工总数达2,100人(工程师约占75%)。

Dialog作为雇主积极承担社会责任,开展各项活动造福员工、社区、其他利益相关方和自然环境。

关键要点
智能手机PMIC市场份额排名***
智能手机RapidCharge?快充电源适配器IC市场份额排名***
可配置混合信号IC(CMIC)市场份额排名***
集成度***,采用可配置电源管理模式的完整系统方法
2017年,我们交付了超过1亿套SmartBond? SoC,创下了里程碑
蓝牙低功耗市场份额排名***,交付了超过1.8亿套具有业内最低功耗的蓝牙芯片。
2018年营收达14.42亿美元

联系方式

  • 公司地址:天津经济技术开发区信环西路19号泰达服务外包产业园