北京招聘

职位描述：
Responsibilities & Duties
Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Lab Testing Engineer positions. Lab Testing Engineers will be responsible for working with a team of engineers and technicians in an analytical lab environment to perform a variety of analyses to support Intel Non-Volatile Memory product manufacturing using various state-of-the-art analytical instruments. The testing areas in labs include Analytical Chemistry, Scanning Electron Microscopy (SEM), Secondary Ion Mass Spectrometry (SIMS), Transmission Electron Microscopy (TEM), Electrical and Physical Failure Analysis. Your responsibilities will include but not be limited to:
- Responsible for lab preparation for factory start up including lab tools install/qual, tool operation training and Intel process driven analytical BKMs development
- Responsible for lab daily operations including sample preparation, data collection and interpretation, customer interaction, tool calibration and other lab sustaining activities
- Providing quality and timely lab support for factory tool quals, module quals, excursion response, and yield improvement effort
- Working in a compressed shift is required (for some testing areas)

Qualifications & Experience
You should possess a Bachelor or a Master of Science degree or a Ph.D. in Material Science, Chemistry, Chemical Engineering, Physics, Computer Science, Electrical Engineering or equivalent experience and/or degree and/or background. Additional qualifications include:
- Ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation
- Good team player and be able to establish collaborative relationships with internal customers
- Knowledge of basic statistics would be an added advantage
- Lab experience with Inductively Coupled Plasma Mass Spectrometry (ICPMS), Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), Transmission Electron Microscopy (TEM), Electrical Testing using Magnum tester and Fault Isolation using emission based techniques or similar would be an added advantage

Business Group Overview
Employees in Intel's Non-Volatile Memory Solutions Group (NSG) work on non-volatile memory from material science and process research, through component design, manufacturing, ASIC, board, solid state drives and SW solutions. They deliver disruptive solutions that are transforming computing across all segments from Internet Portal Data Centers (IPDCs) to Consumer Client Devices such as Ultrabooks and Tablets. They invent, develop, bring to market and support customers with leading-edge non-volatile memory products. Our customers include leading cloud service providers (CSPs), IPDCs, original equipment manufacturers (OEMs), and other leading edge technology companies from around the world. NSG is a dynamic group that is strategically positioned to become the leading non-volatile memory (nvm) solution supplier for the compute segment, driving disruptive computing changes in the industry and is a key organization to expanding markets and continuing growth for Intel. 举报 分享

英特尔全球的***个存储技术研发生产基地，坐落在美丽的海滨城市大连。英特尔大连非易失性存储技术制造基地（Intel Dalian Memory Technology & Manufacturing以下简称DMTM）的拳头产品是英特尔3D NAND芯片。这项低成本高效能的3D NAND产品将撼动现有的市场格局，为我们描绘了一个更加光明的未来。简言之，这里销售的每一块内存芯片，都将对物联网，数据中心，虚拟现实和CPU相关领域的发展产生深远的影响——这些正是英特尔的核心增长领域。因此，大连存储技术研发生产基地对于英特尔的成功以及我们支撑智能互联的世界至关重要。
半导体集成电路是目前中国发展最为迅速的行业之一，并且也是中国“第十二五”“第十三五”等国家战略计划所重点扶持的产业。虽然中国半导体产业起步晚但发展迅速，连续多年保持两位数以上增速，显著高于全球增速。半导体集成电路行业发展前景十分广阔，Intel大连也希望能够接纳并培养出更多更优秀的本土人才。
Why - 集成电路-芯片高端制造
1.芯片制造是高速发展的集成电路产业中极其重要的环节之一；
2.就业前景广阔，待遇优厚；
3.行业技术附加值高，不易被时间淘汰，且从业越久市场价值越高，是一个值得长期发展的前景广阔的行业；
4.国内从业人数逐年增加，产业生态链逐步形成，市场将会有越来越多的晋升机会。
Why – 英特尔半导体是您开启半导体职业生涯的***选择
1.英特尔大连是Intel 全球***的NAND存储芯片集技术研发和规模化量产为一体的基地；
2.接触领先的芯片生产技术；
3.完善的培训体制和以人为本的优秀企业文化；
4.行业内极佳的口碑 & 多年***雇主获得者；
5.极具竞争优势的薪资待遇；
6.工作地点大连 - 气候宜人，房价适中的滨海宜居城市。
申请流程：网申→简历筛选→邀请面试
3.17- 大连理工宣讲
3.18- 大连海事大学宣讲
3.21- 大连现场面试: 海创(大连)科技交流中心酒店
3.22- 东北大学宣讲
3.23- 沈阳：东大校园面试
3.24- 沈阳：香格里拉酒店面试
3.25- 吉林大学宣讲
3.26- 长春：吉大校园面试
3.27- 长春：香格里拉酒店面试